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Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo Shohji
The use of Sn-3mass%Ag-0.5mass%Cu lead-free solder (SAC305) has become common. Since SAC305 has a higher content of tin than conventional tin?lead eutectic solder, erosion of the Fe plating layer used in the solder iron tip and the point soldering machin...
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Young-Gyu Kim and Tae-Hyoung Park
The contribution of this paper is to propose a dual-stream convolutional neural network (CNN) using two solder regions for inspections of surface mount technology (SMT) assembly defects. We extract two solder regions from a printed circuit board (PCB) im...
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Anna Grichting Solder
Pág. 190 - 192
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Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang and Te-Chin Huang
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or...
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Jae-Hyeon Park, Seong-Keun Jeong and Hyun-Ung Oh
A critical-strain-based methodology was proposed to overcome the theoretical limitations of Steinberg?s method, and its effectiveness was experimentally verified through fatigue tests of ball grid arrays, column grid arrays, and lead-type specimens on pr...
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Diogo Francisco Gomes, Ivan Galvão and Maria Amélia Ramos Loja
Laser welding presents a core position in the health sector. This process has had an outstanding impact on the surgical procedures from many medical areas, such as on vascular and nervous surgeries. The aim of the present research is to present an overvi...
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Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and p...
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Tae-Yong Park, Jae-Hyeon Park and Hyun-Ung Oh
Steinberg?s theory, which is based on the fatigue failure theory, has been widely used for predicting the structural safety of solder joints in aerospace electronic units under vibration during launches. However, theoretical limitations are encountered w...
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Chengyin Peng, Dandan Zhu, Kaifeng Li, Xiang Du, Fei Zhao, Mingpan Wan and Yuanbiao Tan
Research on a Low-Melting-Point Solder for a 6063 Aluminum Alloy Cold Plate Radiator.
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Maximilian Schmid, Sri Krishna Bhogaraju, E Liu and Gordon Elger
Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunc...
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Martin Lederer,Golta Khatibi,Brigitte Weiss
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Ephraim Suhir and Reza Ghaffarian
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for w...
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Ephraim Suhir and Reza Ghaffarian
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for w...
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Tae-Yong Park, Seok-Jin Shin and Hyun-Ung Oh
In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration en...
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Soo-Jin Kang, Sung-Woo Park, Hye-Yoon Choi, Gu-Hyun Ryu, Jong-Pil Kim, Sung-Hoon Jung, Se-Young Kim, Hyon-Ik Lee and Hyun-Ung Oh
This paper presents the effectiveness of the thermo-mechanical design of a high-speed digital receiver unit (HSDRU) developed for spaceborne synthetic aperture radar applications. The main features of HSDRU?s thermo-mechanical design include the thermal ...
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M. Bakowski, J. Lang, J-K. Lim, J. Hellén, T.M.J. Nilsson, B. Schodt, R. Poder, I. Belov, P. Leisner
Pág. 157 - 165
The RF power amplifier demonstrators containing each one GaN-on-SiC, HEMT, CHZ015A-QEG, from UMS in SMD quad-flat no-leads package (QFN) were subjected to thermal cycles (TC) and power cycles (PC) and evaluated electrically, thermally and structurally. T...
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Ali Yahyaee, Amir Sajjad Bahman and Frede Blaabjerg
For reliability and thermal management of power devices, the most frequently used technique is to employ heatsinks. In this work, a new configuration of offset strip fin heatsink based on using the concept of curvy fins and U-turn is proposed with the ai...
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Jauhar Ismiyadinata, Harry Yuliansyah, Muhammad Reza Kahar Aziz, Arief Syaichu Rohman, Dr.
Pág. 9 - 16
This article proposes a design of 400 watt inverter with frequency of 50 Hz at voltage of 12 Vdc input and 220 Vac output. This inverter is designed to convert the Direct Current (DC) into Alternating Current (AC) voltage with the purpose to utilize DC e...
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