|
|
|
|
|
Jianrong Xiao, Chenyang Gong, Meng Qi, Aihua Jiang, Zhiyong Wang, Ming Li and Jiafeng Ma
Deposition techniques of direct current and radio-frequency magnetron sputtering were used to separately prepare TiN/C microstructural composite layer and fluorinated diamond-like carbon (FDLC) film on monocrystalline silicon. The aim was to investigate ...
ver más
|
|
|
|
|
|
|
|
|
|
|
Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo Shohji
The use of Sn-3mass%Ag-0.5mass%Cu lead-free solder (SAC305) has become common. Since SAC305 has a higher content of tin than conventional tin?lead eutectic solder, erosion of the Fe plating layer used in the solder iron tip and the point soldering machin...
ver más
|
|
|
|
|
|
|
|
|
|
|
Yinan Li, Xianbao Liu, Zhikang Zhou, Lei Zhang and Zilong Peng
A TiN and TiN·Ti2Cu reinforced copper matrix composite layer was cladded onto a T3 copper substrate to improve the anti-wear performance of copper products by means of the nitrogen-shielded gas tungsten arc cladding method (N2-GTAC). Better than the trad...
ver más
|
|
|
|
|
|